It’s Only Common Sense: Selling Without Selling
Dan’s Biz Bookshelf: ‘The Art of Going SLOW’
Happy’s Tech Talk #39: PCBs Replace Motor Windings
Taiyo Announces New Director & COO at Taiyo America, Inc. Facility in Nevada
July 22, 2015 | Taiyo AmericaEstimated reading time: Less than a minute
Taiyo America, Inc. announced that the company has promoted Tadahiko Hanada to Director & COO, effective July 1, 2015.
Mr. Hanada earned a B.S. degree in physics from Kyoto University in Japan and started his career as a researcher of fiber optic devices at NEC Corporation in 1991.
Since then he has contributed to broad areas including R&D, Product Development, Design, Product Release, Marketing, Sales, Product Strategy, Product Planning for Telecommunications, Data Communication, Mobile Phones, as well as the Cloud Service industry.
Mr. Hanada joined TAIYO INK MFG. CO., LTD. in January 2014 as General Manager leading the IC Packaging Material business.
“Tadahiko Hanada is a great endowment to Taiyo America and I look forward to his valuable management of the Carson City facility”, said Kashima, Taiyo America’s President.
About Taiyo America, Inc.
Established 25 years ago TAIYO AMERICA, INC. is a subsidiary of TAIYO HOLDINGS CO., LTD., the world's leading manufacturer of specialty inks and solder masks for printed circuit boards. Taiyo offers conductive inks for manufacturing printed electronics, solar cells and other applications. For more information, visit www.taiyo-america.com.
Melanie Wylie Binzel
775.885.9959, ext. 139
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.